The critical bottleneck limiting Nvidia H100 GPU shipments is not front-end wafer fabrication at 4nm/5nm, but TSMC's CoWoS (Chip-on-Wafer-on-Substrate) advanced 2.5D packaging capacity. Integrating HBM3 memory stacks onto a silicon interposer with the GPU die requires specialized micro-bump bonding that conventional packaging lines cannot perform, establishing packaging as the physical pacing factor for datacenter compute. nextbigfuture.com